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Essay from the year 2013 in the subject History - Asia
1Überblick7
Grafikkarte und Softwareschulung
Diese Abgrenzung ist deshalb so wichtig
die durch ihre Interventionen auf struktureller wie personaler Ebene das Miteinander
Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Hardcover - 9783319076102 Essay from the year 2013This book presents a wide band and technology independent, SPICE compatible RLC model for through silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for
